3W SFP Interface Development
Turunen, Joonas (2022)
Turunen, Joonas
2022
All rights reserved. This publication is copyrighted. You may download, display and print it for Your own personal use. Commercial use is prohibited.
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:amk-2022092920595
https://urn.fi/URN:NBN:fi:amk-2022092920595
Tiivistelmä
New technologies allow and demand increasing levels of data being transferred. Increasing levels of data being transferred, results increase of energy used in transferring devices. This leads to need for more efficient cooling systems.
3W SFP module design project was done in period of 1.2. -30.6. 2022, as part of new product platform development. When the thesis work started, 1.4. 2022, most of concepting and designing was already done.
The work started with small heat sink design adjustments. Thermal interface design deals with thermal boundary resistance between connected solid bodies. Main tools for cope this problem are interface materials and contact pressure.
Thesis work´s focus was on conducting thermal test of designed prototypes and TIMs. Efficiency of interface was calculated from measured temperature difference. Effect of contact pressure was studied by recording its effect on temperature difference. A special jig was designed for this.
Tests indicated that increased pressure is beneficial and interface with silicon-based TIM gain efficiency with moderate pressures.
Based on tests, two thermal interface concepts were selected for further development and productization.
3W SFP module design project was done in period of 1.2. -30.6. 2022, as part of new product platform development. When the thesis work started, 1.4. 2022, most of concepting and designing was already done.
The work started with small heat sink design adjustments. Thermal interface design deals with thermal boundary resistance between connected solid bodies. Main tools for cope this problem are interface materials and contact pressure.
Thesis work´s focus was on conducting thermal test of designed prototypes and TIMs. Efficiency of interface was calculated from measured temperature difference. Effect of contact pressure was studied by recording its effect on temperature difference. A special jig was designed for this.
Tests indicated that increased pressure is beneficial and interface with silicon-based TIM gain efficiency with moderate pressures.
Based on tests, two thermal interface concepts were selected for further development and productization.